BERGQUIST GAP PAD TGP 3004SF
Gap Pad
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. This product has no silicone content and is therefore ideal for silicone sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
- Thermal Conductivity: 3.0 W/m-K
- Silicone-free formulation
- Tacky side allows for ease of handling and placement
- 0.25 mil PET provides easy disassembly, leaving no residue
| Carrier type | 0.25 mil PET Film |
| Color | Light Gray |
| Density, Maximum Final | 3.2 g/cm³ |
| Flame rating | V-0 |
| Operating temperature | -40.0 – 125.0 °C |
| Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 °C Shore 00 | 70.0 |
| Standard thickness | 0.254 – 3.715 mm |
| Thermal conductivity | 3.0 W/mK |
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