BERGQUIST GAP PAD TGP 1000VOUS

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behaviour.

BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a “gel-like” modulus that provides shock absorbing and low stress vibration dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.