BERGQUIST GAP PAD TGP HC3000
Gap Pad
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
- Thermal conductivity: 3.0 W/m-K (ASTM D5470)
- High-compliance, low compression stress
- Minimal compression set
| Carrier type | Fiberglass |
| Color | Blue |
| Flame rating | V-0 |
| Operating temperature | -60.0 – 200.0 °C |
| Standard thickness | 0.508 – 3.175 mm |
| Thermal conductivity | 3.0 W/mK |
| Young’s modulus, ASTM D575 | 110.0 KPa (16.0 psi ) |
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