BERGQUIST GAP PAD TGP 6000ULM

A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).

BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, thereby eliminating the need for additional adhesive layers and provides stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.