BERGQUIST GAP PAD TGP 1500R

Gap Pad

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BERGQUIST GAP PAD TGP 1500R, Thermally Conductive, Reinforced Gap Filling Material

BERGQUIST® GAP PAD TGP 1500R has the same highly conformable, low-modulus polymer as the standard GAP PAD TGP 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance.

  • Thermal Conductivity: 1.5 W/m-K
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Electrically isolating
  • Easy release construction
Carrier typeFiberglass
ColorBlack
Operating temperature-60.0 – 200.0 °C
Standard thickness0.254 – 0.508 mm
Thermal conductivity1.5 W/mK
Young’s modulus, ASTM D575310.0 KPa (45.0 psi )

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