BERGQUIST BOND PLY TBP 1400LMS-HD
Bond Ply
Highly durable, thermally conductive material that is ideal for securing power components and PCBs to a heat sink. Eliminates mechanical fasteners.
BERGQUIST® BOND PLY TBP 1400LMS-HD is a highly durable laminate material that is heat curable and eliminates the need for mechanical fasteners. The high performance, flexible silicone design provides exceptional thermal range and effectively absorbs vibrations and other mechanical stresses caused during the assembly process. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
- TO-220 Thermal performance: 2.3°C/W, initial pressure only lamination
- 200 psi adhesion strength
- 200 psi adhesion strength
- Very low interfacial resistance
| Carrier type | Fiberglass |
| Color | Yellow |
| Flame rating | V-0 |
| Operating temperature | -60.0 – 180.0 °C |
| Storage temperature | 5.0 – 25.0 °C |
| Thermal conductivity | 1.4 W/mK |
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TEL : 607-861 6871
