BERGQUIST GAP PAD TGP 1000VOUS
Gap Filler
BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
- Thermal conductivity: 1.0 W/m-K
- Ultra-conforming, designed for fragile and low-stress applications
- Ambient and accelerated cure schedules
- 100% Solids – no cure by-products
| Cure schedule, @ 100.0 °C | 5.0 min. |
| Cure schedule, @ 25.0 °C | 60.0 – 120.0 min. |
| Density | 1.6 g/cm³ |
| Dielectric constant, @ 1kHz | 5.0 |
| Flame rating | V-0 |
| Heat capacity, ASTM E1269 | 1.0 J/g-K |
| Mix ratio, by volume | 1 : 1 |
| Mix ratio, by weight | 1 : 1 |
| Pot life, @ 25.0 °C | 15.0 min. |
| Shelf life | 6.0 mon. |
| Shore hardness, Thirty second delay value, ASTM D2240 Shore 00 | 30.0 |
| Storage temperature | 25.0 °C |
| Thermal conductivity | 1.0 W/mK |
| Volume resistivity | 1×10 Ohm m |
| Resin | |
| Color, Resin | Gray |
| Hardener | |
| Color, Hardener | White |
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