BERGQUIST GAP PAD TGP 1000VOUS

Gap Filler

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BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
  • Thermal conductivity: 1.0 W/m-K
  • Ultra-conforming, designed for fragile and low-stress applications
  • Ambient and accelerated cure schedules
  • 100% Solids – no cure by-products
Cure schedule, @ 100.0 °C5.0 min.
Cure schedule, @ 25.0 °C60.0 – 120.0 min.
Density1.6 g/cm³
Dielectric constant, @ 1kHz5.0
Flame ratingV-0
Heat capacity, ASTM E12691.0 J/g-K
Mix ratio, by volume1 : 1
Mix ratio, by weight1 : 1
Pot life, @ 25.0 °C15.0 min.
Shelf life6.0 mon.
Shore hardness, Thirty second delay value, ASTM D2240 Shore 0030.0
Storage temperature25.0 °C
Thermal conductivity1.0 W/mK
Volume resistivity1×10 Ohm m
Resin 
Color, ResinGray
Hardener 
Color, HardenerWhite

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