BERGQUIST GAP FILLER TGF 1100SF
Gap Filler
BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.
- Thermal Conductivity: 1.1 W/m-k
- No silicone outgassing or extraction
- Ultra-conforming, designed for fragile and low-stress applications
- Ambient and accelerated cure schedules
| Cure schedule, Recommended @ 25.0 °C | 24.0 hr. |
| Density | 2.0 g/cm³ |
| Dielectric constant, @ 1kHz | 5.0 |
| Flame rating | V-0 |
| Heat capacity, ASTM E1269 | 0.9 J/g-K |
| Mix ratio, by volume | 1 : 1 |
| Mix ratio, by weight | 1 : 1 |
| Pot life, @ 25.0 °C | 4.0 hr. |
| Shelf life | 6.0 mon. |
| Shore hardness, Thirty second delay value, ASTM D2240 Shore 00 | 60.0 |
| Storage temperature | 25.0 °C |
| Thermal conductivity | 1.1 W/mK |
| Volume resistivity | 1×10 Ohm m |
| Resin | |
| Color, Resin | Yellow |
| Hardener | |
| Color, Hardener | Red |
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