BERGQUIST GAP FILLER TGF 2000
Gap Filler
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
- Ultra-conforming, designed for fragile and low-stress applications
- Thermal conductivity: 2.0 W/m-K
- 100% Solids – no cure by-products
- Ambient and accelerated cure schedules
| Density | 2.9 g/cm³ |
| Dielectric constant, @ 1kHz | 7.0 |
| Flame rating | V-0 |
| Heat capacity, ASTM E1269 | 1.0 J/g-K |
| Mix ratio, by volume | 1 : 1 |
| Mix ratio, by weight | 1 : 1 |
| Shelf life | 6.0 mon. |
| Shore hardness, Thirty second delay value, ASTM D2240 Shore 00 | 70.0 |
| Storage temperature | 25.0 °C |
| Thermal conductivity | 2.0 W/mK |
| Volume resistivity | 1×10 Ohm m |
| Resin | |
| Color, Resin | Pink |
| Hardener | |
| Color, Hardener | White |
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