BERGQUIST GAP FILLER TGF 3500LVO
Gap Filler
A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 3500LVO is a 3.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). The ultra-conforming feature combined with its low volatility makes it the ideal solution for use in medical electronics and other fragile or low stress assemblies such as Optics and Automotive in-cabin electronics. The mixed system provides infinite thickness variations without adding extra stress to components and will cure at room temperature or can be sped up with the addition of heat. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
- Thermal conductivity: 3.5 W/m-K
- Low volatility for outgassing sensitive applications
- Ultra-conforming with excellent wet-out for low stress interfaces on applications
- 100% Solids – no cure by-products
| Cure type | Heat Cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 – 200.0 °C |
| Thermal conductivity | 3.5 W/mK |
| Mixed | |
| Color, Mixed | Light Blue |
| Resin | |
| Color, Resin | Blue |
| Hardener | |
| Color, Hardener | White |
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TEL : 607-861 6871
