BERGQUIST GAP FILLER TGF 3600
Gap Filler
A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.
BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra high thermal performance and superior softness. This product has low modulus to help relieves CTE stresses in thermal cycling and also provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
- Thermal conductivity: 3.6 W/m-K
- Ultra low Modulus
- Ultra conforming
- Easily dispenable
- UL94 V-0 compliance
| Cure type | Heat Cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 – 200.0 °C |
| Thermal conductivity | 3.6 W/mK |
| Mixed | |
| Color, Mixed | Blue |
| Resin | |
| Color, Resin | White |
| Hardener | |
| Color, Hardener | Blue |
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