BERGQUIST GAP PAD TGP 1350

Gap Pad

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BERGQUIST GAP PAD TGP 1350 is a silicone, highly conformable, thermally conductive and reworkable gap filler for fragile components.

BERGQUIST® GAP PAD TGP 1350 is a pre-cured silicone based thermally conductive gap pad. It is reinforced with a PEN film which not only allows rework but also improves resistance to puncture and tear. This product is highly conformanble and compliant making it ideal for the assembly of fragile components. It is also highly durable and UL 94 V-0 compliant.

  • Thermal conductivity: 1.3 W/m-K
  • Easily compressible (shore OO 30)
  • High durability
  • UL94 V-0 compliance
Carrier typePEN Film
ColorLight Pink
Operating temperature-60.0 – 150.0 °C
Thermal conductivity1.3 W/mK

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