BERGQUIST GAP PAD TGP 2000SF
Gap Pad
BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/mK). While highly thermally conductive, the material is exceptionally soft and more compliant than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is capable of conforming to the most demanding contours while applying little stress on component leads.
- High Thermal Conductivity: 2 W/m-K
- Natural inherent tack reduces interfacial thermal resistance and aids assembly
- Fiberglass reinforced for puncture, shear and tear resistance
- Conforms to demanding contours and maintains structural integrity with little stress applied to fragile component leads
| Carrier type | Fiberglass |
| Color | Green |
| Operating temperature | -60.0 – 125.0 °C |
| Standard thickness | 0.254 – 3.175 mm |
| Thermal conductivity | 2.0 W/mK |
| Young’s modulus, ASTM D575 | 228.0 KPa (33.0 psi ) |
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