BERGQUIST GAP PAD TGP 3000ULM
Gap Pad
A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 3000ULM is an extremely soft, thermal interface material with a higher natural tack, thereby eliminating the need for additional adhesive layers and provides stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
- Thermal Conductivity: 3.0 W/m-K (ASTM D5470)
- Fiberglass reinforced for puncture, shear, and tear resistance
- High-compliance, low compression stress
- Non-fiberglass option available when additional stress reduction is required
- Supplied with protective liners for ease of use
| Color | Blue |
| Operating temperature | -60.0 – 200.0 °C |
| Thermal conductivity | 3.0 W/mK |
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