Our machines are engineered for low pressure molding applications. Using specialty resins to encapsulate delicate parts. Applications including : automotive electronics, PCBA，coil, fiber-optic, LED lighting, wire, cable, etc.
- Hot runner system eliminates runner resin and improve productivity.
- 5 liter melting tank and machine is separate.
- User-friendly interface, 7″ Touch screen operator with multi-language PLC.
- Critical components(gear pump, valve and nozzle) are designed for PA adhesive and made overseas.
- Equipped with light curtain and dual palm buttons for operator safety.
- Ejection system is equipped
Schedule A Free Consultation
We’re happy to answer any questions you may have and help you determine which of our services best fit your needs.
TEL : 607-861 6871
