LPMS 500

C-Frame Machine with Melt-on-Demand Technology

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Our machines are engineered for low pressure molding applications. Using specialty resins to encapsulate delicate parts. Applications including : automotive electronics, PCBA,coil, fiber-optic, LED lighting, wire, cable, etc.

  • Melt-on-Demand Technology helps resin melt completely within
    8-15minutes(measure based on resin softening temperature at 100~160 °C).

  • Equipped auto-feeding system and dryer machine (optional) enhance productivity.

  • User-friendly interface, 7″ Touch screen operator with multi-language PLC.

  • Individual temperature control of tank and injection gun for variety works.

  • Over temperature alarm and automatic heating stop functions are included.

  • Extreme safety light curtain and two photoelectric switches to protect workers.

  • Products ejection system is equipped.

Schedule A Free Consultation

We’re happy to answer any questions you may have and help you determine which of our services best fit your needs.

TEL : 607-861 6871